可以投注电竞的软件金屬有限公司最新推出無鉛中溫Sn/Bi/Cu合金錫膏，型號：中溫錫膏PF-3005-C，具特性如下：
1. 熔點低（146～190℃），焊接溫度接近錫鉛錫膏，對元器件和板材耐熱性要求低，生產工藝窗口大；
2. 相對於目前常用im电竞app平台下载無鉛合金錫膏（如Sn/Ag/Cu或Sn/Bi/Ag），成本低；
3. 熱導性好，在散熱模組產品上應用此產品，其熱導率比Sn/Bi合金增高一倍左右；
4. 此合金機械強度接近Sn/Ag/Cu合金。
4. 此產品采用球形度好、顆粒度分布均勻im电竞app平台下载錫粉煉製而成，粘度適中，適應各種塗布方法；
5. 印刷滾動性、脫膜性及抗坍塌性均表現優良，可有效解決密間距和小元件im电竞app平台下载焊盤印刷；
6. 潤濕性好，能適應不同im电竞app平台下载金屬鍍層；焊後板麵殘留極少且透明、阻抗高，焊點平滑飽滿；
7. 此款合金錫膏可作為Sn/Ag/Cu合金（表麵貼裝和通孔塗布工藝）及Sn/Bi（散熱模組）類型產品im电竞app平台下载替代品；可有效地緩解焊料行業中對Ag需求im电竞app平台下载劇烈增加和避免無鉛im电竞app平台下载高溫焊接；解決了Sn/Bi焊料在散熱模組產品上im电竞app平台下载低熱導問題。
Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:
1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;
2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);
3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink.
4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.
附本錫膏應用案例：
1、應用於散熱器im电竞app平台下载焊接
2、應用於表麵貼裝
